“光明,，因你成就,！”
Position Summary (崗位描述)
Product design and process integration to ensure New Product/Process/Material are meeting requirement, stable and well-integrated into manufacturing line with all quality & reliability issue assessed and addressed prior release for product launch.
負責產(chǎn)品封裝設(shè)計和工藝整合以滿足新產(chǎn)品/工藝和材料符合開發(fā)要求，在產(chǎn)品量產(chǎn)前進行質(zhì)量和可靠性評估使其穩(wěn)定和完好地整合到產(chǎn)線,。
Key Responsibility (主要職責)
1. Leading Package design and process integration, leading design &DFMEA review with global team
領(lǐng)導(dǎo)LED封裝設(shè)計和工藝整合,，領(lǐng)導(dǎo)與國際團隊的設(shè)計FMEA的評審
2. Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform
生成和維護封裝構(gòu)成要素的知識并分享，領(lǐng)導(dǎo)針對已有產(chǎn)品平臺的X項目的封裝構(gòu)成要素的開發(fā),。
3. Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment
確保新產(chǎn)品和新產(chǎn)品平臺的協(xié)同效應(yīng)（標準化&盡量減少認證材料）,，關(guān)注產(chǎn)品平臺的健康與發(fā)展，領(lǐng)導(dǎo)產(chǎn)品平臺的技術(shù)風險評估,。
4. Enable and support Dt-X(design to cost/test/manufacturability)
確保和支持設(shè)計符合成本/測試/可制造性的要求
5. Define Building Block design rules, regular alignment between site PDI's
制定封裝構(gòu)成要素的設(shè)計規(guī)則并定期性地與全球PDI協(xié)調(diào)一致,。
6. Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)
啟動已有產(chǎn)品/產(chǎn)品平臺績效改善項目（Q5以后），開發(fā)衍生產(chǎn)品/改善產(chǎn)品平臺（如測試新材料）
7. Consultant and supporting technical issues/complaints related to design from operation
對來自運營部門的與設(shè)計相關(guān)的技術(shù)問題/客戶投訴提供技術(shù)咨詢和支持
8. Other tasks assigned by Supervisor
主管安排的其他工作
Qualification (任職者要求)
1. Bachelor degree or Master in Electrical /Electronic Engineering /semiconductor field
電子/電氣工程,，半導(dǎo)體領(lǐng)域的學(xué)士或碩士學(xué)位
2. Above 8years working experience in LED process like die bonding, wire bonding, casting/molding, Trim &From and Sawing.
8年以上的LED工藝經(jīng)驗,，如芯片貼片工藝，引線鍵合工藝,，注膠/塑封工藝,，切筋成型和切割工藝
3. Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma
有封裝設(shè)計、工藝整合,、模擬和項目管理的經(jīng)驗,，熟悉DFMEA, DFSS, QFD and Six Sigma
4. CET-4 Minimum, CET-6 preferred. Familiar with Solidworks
候選人要求通過最低英語四級，優(yōu)先考慮六級,，熟悉使用Solidworks
5. Can fluently use different version of office software
熟練使用不同版本的辦公軟件
6. Others: Able to work with stress and adapt to fast changes; Good team player.
其他：能在壓力下工作并適應(yīng)快速變化的工作,，具有團隊合作精神
