“光明，因你成就,！”
1.Applying DB process expertise and technology to make process management to fulfill quality, cost, yield, capacity, delivery requirement運(yùn)用裝片工藝專業(yè)知識(shí)和技術(shù)進(jìn)行過程管理,，以滿足質(zhì)量、成本,、良率,、產(chǎn)能和交貨要求
2.Make advanced data analysis, DOE study of DB process parameters to ensure DB process control in excellent condition 對(duì)裝片工藝參數(shù)進(jìn)行先進(jìn)的數(shù)據(jù)分析和DOE研究，確保裝片工藝控制處于***狀態(tài)
3.New DB process/machine/DM/IDM setup and introduction新裝片工藝/設(shè)備/直接物料/非直接物料的建立和引進(jìn)
4.Investigate, analyze, report, and follow up quality cases調(diào)查,、分析,、報(bào)告和跟進(jìn)質(zhì)量問題事件
5.PFMEA, Control Plan, SOP, WI, OCAP generation and update PFMEA，控制計(jì)劃,，SOP, WI, OCAP的生成和更新
6.Other tasks assigned by manager and supervisor完成經(jīng)理和主管安排的其他任務(wù)
崗位要求：
1. Bachelor’s degree or above本科及以上學(xué)歷
2. 5 years or above semiconductor backend process related working experience 5年及以上半導(dǎo)體后端工藝相關(guān)工作經(jīng)驗(yàn)
3. Major in electronics or materials science or physics 電子,、材料科學(xué)或物理專業(yè)
4. Familiar with backend processes, Casting & Layer Transfer etc.
熟悉后道封裝工藝,， Casting & Layer Transfer 等,。
5. Familiar with the FMEA / CP/OCAP/SPC tools熟悉FMEA / CP/OCAP/SPC工具
6. Good team and project player, lean 6 sigma green/yellow belt project experience is preferred 良好的團(tuán)隊(duì)和項(xiàng)目參與能力，有精益6西格瑪綠/黃帶項(xiàng)目經(jīng)驗(yàn)者優(yōu)先
7. Good skill on writing & Speaking English, office software and reporting良好的英語聽說讀寫能力,，辦公軟件和報(bào)告能力
8. Good skill on communication in internal & external team良好的內(nèi)部和外部團(tuán)隊(duì)溝通能力
