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Responsibilities:

? Ensure the quality of BECM / BMS launch event, verify launch quality during PPAP, spot issues at global and local supplier site, solve launch issues (incl. solder defect, IC defect under SEM…etc.), deliver gap assessment and track for closing the gap.

負(fù)責(zé)確保并提升投產(chǎn)質(zhì)量，在PPAP中分階段執(zhí)行相應(yīng)任務(wù)：在國(guó)內(nèi)以及全球供應(yīng)商駐場(chǎng),，發(fā)現(xiàn)并解決投產(chǎn)當(dāng)中的各類問題（包括但不限于解決焊接質(zhì)量,，識(shí)別并引導(dǎo)供應(yīng)商解決零部件級(jí)別問題，例如芯片缺陷等）,，提交問題與差距分析報(bào)告并且負(fù)責(zé)消弭差距,。

? Get familiar with Ford manufacturing requirement and DV. Define manufacture requirements for suppliers. Perform assessment on the process feasibility and robustness (e.g. deep dive on SMT / wave soldering spec / workstation design sequence & logic…etc.) and summarize suppliers’ manufacturing capability during sourcing via either online meeting or on-site visit. Deliver capability and gap assessment with expertise for suppliers.

熟悉福特制造基礎(chǔ)流程與要求，以此設(shè)立供應(yīng)商生產(chǎn)要求,。針對(duì)不同供應(yīng)商產(chǎn)線設(shè)計(jì)與方案（SMT,，波峰焊，工位設(shè)計(jì)邏輯等等）做出可行性與可靠性評(píng)判,，并找出潛在問題點(diǎn),。運(yùn)用自身產(chǎn)線經(jīng)驗(yàn)與專業(yè)，針對(duì)供應(yīng)商交付差距項(xiàng)分析

? Develop BECM DVP and conduct DV&PV at test lab, deliver qualified report.

交付并完善DV計(jì)劃,，現(xiàn)場(chǎng)監(jiān)督執(zhí)行DV&PV,，交付實(shí)驗(yàn)報(bào)告

? Cooperate with layout team to deliver PCB layout without manufacturing issue. Deliver launch & quality issue assessment and solve together with core & application team.

與PCB布局團(tuán)隊(duì)一起交付符合制造要求的設(shè)計(jì)。與核心研發(fā)團(tuán)隊(duì)以及應(yīng)用團(tuán)隊(duì)一起解決投產(chǎn)問題跟質(zhì)量問題

? Travel domestic & international.

工作需要國(guó)內(nèi)/國(guó)際出差與供應(yīng)商常駐

? 3~5 years’ experience of ECU / phone / control related circuit board launch & validation, prefered with experience of BMS, IC failure or related design experience.

3~5年ECU或電子產(chǎn)品投產(chǎn)跟驗(yàn)證經(jīng)驗(yàn),，有BMS/BECM投產(chǎn)經(jīng)驗(yàn),，IC失效分析經(jīng)驗(yàn)優(yōu)先

? Familiar with PPAP and PCBA manufacturing process, general requirements and spec, including but not limited to SMT spec, IPC Class, Gage R&R..etc. Experience with solving manufacturing issues. Know-how with IC analysis tool.

熟悉PPAP與PCBA制造工藝流程，基礎(chǔ)要求以及規(guī)范,，包括但不限于：基礎(chǔ)的SMT規(guī)范,，IPC等級(jí)對(duì)應(yīng)的工藝要求與結(jié)果判斷，PPAP中的量具R&R等,。具備解決投產(chǎn)與量產(chǎn)棘手問題的經(jīng)驗(yàn),，了解芯片失效分析工具，能針對(duì)IC供應(yīng)商提交的芯片失效報(bào)告進(jìn)行分析與判斷,。

? Master Degree in Microelectronics Engineering/Electrical Engineering/Automation is preferred.

電子/電氣/自動(dòng)化碩士?jī)?yōu)先

? English Skill: Proficiency

英文要求：溝通熟練

? Strong Communication, Planning Skills and Self-Starter capable of delivering results.

希望您能有較強(qiáng)的溝通與計(jì)劃能力,，內(nèi)驅(qū)力強(qiáng)，交付成果為導(dǎo)向

? Demonstrated initiative, discover the flaw in process during development. Integrity and teamwork orientation

希望您能有主動(dòng)性,，善于預(yù)測(cè)并糾正開發(fā)中的制造流程隱患,，為人正直并具有團(tuán)隊(duì)合作精神。